Description:
Summary To lead the development, optimization, and stabilization of plating and etching processes for advanced semiconductor packaging, contributing to mass production readiness, yield improvement, and customer-specific technical solutions. Job Develop and optimize electroplating, seed etching, and PR stripping processes Design and improve processes for TSV, RDL, Cu pillar, and micro bump formation Evaluate and introduce new materials and equipment for plating/etching process integration Conduct pre-production process validation and yield stabilization …