Job Ref: L8W49X6R 

Qualification :

10-15 years of experience in process engineering, assembly engineering,

or a related field in the Semiconductor industry.

Background in Die bond / Wire bond process with high volume production management

Strong analytical and troubleshooting abilities to resolve production issues effectively.

Supervisory and Management skills

Good knowledge in LEAN, SIX SIGMA, SPC, MSA, etc.

Good Command of English.