Semicon Equipment Engineer (Wafer SAW & Laser Groove)
Job Description:
- Responsible for maintenance and repair on any of the following equipment such as DISCO Wafer SAW (DFD 6360 and DFD6361) and DISCO laser groove.
- Manage a team of associate engineers.
- Provide technical support to manufacturing that includes machine conversion, device setup and line sustaining.
- Ensures 100% support to engineering group on device & recipe creation, equipment buy-off, evaluations, qualifications and support new product introduction NPI.
Communicates with Manufacturing, Process, QA, Central Engineering (NPI) to solve issues involving other group
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: 6950 9737
EA License Number: 02C4944
EA Personnel Reg nos R1110618
Job Id :
Required Skills:
Resume Salary Reason MS Word LTD Manufacturing Technical Support Email Maintenance Engineering