Job

Develop AOI inspection conditions and perform defect analysis for bump, RDL, and TSV processes

Operate and optimize 2D/3D AOI systems and inspection parameters

Configure AOI inspection algorithms for new product designs

Set up process conditions and equipment configurations for new packages and production lines

Optimize reflow parameters and temperature profiles

Analyze solder/micro bump quality and implement improvements

Conduct root cause analysis and implement corrective actions for process issues

Support customer quality requirements through technical evaluation and documentation

Supports mass production and quality control in the advanced semiconductor packaging process

Contributes to defect reduction, process stability, and customer satisfaction

Drives yield and reliability improvements in AOI and reflow process areas

Requirement:

Bachelors degree or higher in Engineering or Science (e.g., Material Science, Chemical Engineering, Electronics)

Minimum 3 years of experience in AOI or reflow process in semiconductor backend

Ability to establish process conditions and optimize parameters

Strong data analysis and problem-solving skills

Proficient in writing technical documents and communicating in English

Knowledge of inspection or reflow/soldering principles

Experience in defect analysis and developing defect evaluation criteria

Required experience with bump and RDL inspection

Basic understanding of thermal, electrical, and material behavior in reflow processes

Experience in advanced packaging process such as 2.5D, fan-out and flip-chip

Familiarity with quality tools such as APQP, FMEA and 8D methodology

Experience in responding to customer quality requirements or certification audits

Ability to write technical documentation and communicate in English

Hand-on experience with major AOI equipment(e.g., KLA, onto, Camtek)

Collaborative experience in AOI image analysis and algorithm development

Experience in developing inspection criteria and technologies for parameters such as co-planarity, tilt, and voids.

Experience in quality and reliability evaluation related to reflow or soldering processes

Understanding of associated assembly/joining processes (eg. Bonding, chip attach)

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

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