Job Title: R&D Process Engineer (MOLD)

Summary:

Process development and characterization for R&D projects.

To lead the development, optimization, and stabilization of wafer level molding and related processes for advanced semiconductor packaging, contributing to mass production readiness, yield improvement, and customer-specific technical solutions.

Job

Develop wafer level Molding and debond process capabilities to achieve a good quality and wafer warpage for advanced packaging technologies including 2.5D, fan-out, and SiP

Perform DOE planning, continuous improvement, engineering evaluation and analyze experimental data using statistical tools (e.g., JMP)

Qualify new materials (direct and indirect), tools, equipment on new package and device qualification.

Conduct pre-production process validation and yield stabilization

Provide technical support for customer programs

Troubleshoot quality issues.

Review the FMEA, OCAP and Control Plan of new packages to achieve better yield and assembly performance prior and during LVM transition.

Supports fan-in and fan-out advanced packaging development processes in molding, debond, wafer resize.

Contributes directly to process yield, quality improvement, and customer technical satisfaction.

Drives technical innovation in advanced packaging technologies in alignment with global customer programs

Requirement :

Bachelors degree in Engineering (Mechanical/Materials/Electronics)

3-5years of hands-on experience in process engineering for wafer level molding in semiconductor manufacturing

Fundamental understanding of advanced semiconductor fabrication and integration processes

Proficiency in preparing technical documentation and delivering presentations

Knowledge in molding process: machine, materials, procedures, operations, quality requirements

Knowledge of advanced packaging technologies including 2.5D, fan-out, and flip-chip

Familiarity with related processes such as debond, warpage adjust, wafer resize.

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID: