Process Director (wafer Bump)
Job Description:
Summary
Plan and direct all aspects of engineering activities
Drive team for continuous improvement in cost, yield and quality
Responsible for setting up department KPIs
Job :
Understand customer requirements and meet/exceed customer goals
Drive team to set up stable manufacturing processes with CpK >1.67
Drive engineering discipline (use DOEs and Statistical Process Engineering tools) in cost, yield and quality improvement
Arrange training for Process Managers and Engineers.
Deploy FDC and SPC on key equipment
Partnership with cross functional teams to meet production schedules, quality and safety
Customer engineering and issues resolution
Requirement
Degree in Electrical/Electronics/Mechanical/Chemical Engineering/Chemistry or its equivalent with minimum of 15 years engineering experience in wafer fab or wafer bumping house, with at least 5 years management experience at Director/Deputy Director level in a fast moving environment
Thorough knowledge of wafer level packaging, engineering and production
Have experience in setting up FDC and SPC
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: 6950 9737
EA License Number: 02C4944
EA Personnel Reg nos R1110618
Job ID:
Required Skills:
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