Manufacturing Engineer

Title: Manufacturing Engineer

Description:

As an Manufacturing Engineer team, you will be tasked with delivering manufacturing solutions for PCBAs and Lidar assembly driving complete manufacturing cycle (NPI, Supplier Bring-up and Transfer, High Volume Scaling and Sustaining).

Candidate is an expert with a proven track record to successfully develop, qualify and scale-up new manufacturing processes in collaboration with Contract Manufacturers (CM) with strong specialization in PCBs, PCBAs, COBs and Device Packaging.

Candidate is hands on and has an extensive understanding of the tools, processes and techniques used to manufacture PCBAs as you'll be primarily working onsite collaborating directly with the CMs technical and manufacturing teams at their factory while supporting the US AME team remotely.

Key Responsibilities:

• This is an in-region position that involves daily interaction with the local CM at their factory. Candidate is a local residence that can travel to US office a few times a year.
• Working with both internal teams and local CM to define, develop, qualify and scale-up PCBA manufacturing processes.
• Working with cross-functional teams to sustain the manufacturing and quality processes to ensure compliance to customer's manufacturing standard which requires early detection and resolving of technical issues, highlighting quality risks to core teams and tracking on-going reliability test performance.
• Support DFM, materials and suppliers' selection, vendor audit/validation and various cost down initiatives.
• Working directly with CM to achieve build readiness on schedule which requires coordination with designers, MPM, production planner, BOM, tooling and module engineers.
• Provide feedback to drive continuous improvement and training to production team at CM.

Minimum Qualifications:

• Bachelor's degree or equivalent in Electrical, Mechanical, Manufacturing Engineering, or a related discipline.
• Expert in SMT processes including PCBA testing and TLA assembly or Mechanical hardware assembly.
• 10+ years working experience in the PCBs, PCBAs, COBs (Chips on Boards) and Device Packaging industry.
• Excellent understanding of PCB and PCBA processes, fixture / tooling, metrology and failure analysis.
• Knowledgeable in statistical analysis and data visualization.
• Strong experience in writing technical reports and SOP in English.
• Experience using tools to assess PCB design and perform DFM (Valor and Allegro).
• A motivated self-starter with organizational skills; excellent verbal and written communication skills.

Preferred Qualifications:

• Experience with Lidar assembly process, test and packaging.
• Knowledgeable in Mechanical modeling (eg. Solidworks, Catia) and statistical analysis software (eg. Jmp, Minitab).
• Experience in operating micro-assembly and packaging equipments (eg. Datacon,Finetech, Ficontec, ASM, Palomar, K&S).
• Familiar with a fast-pace working environment.
• Familiar with PCB design and methodology.