SQE-System in Package

Responsibilities

• The Supplier Quality Engineer will be responsible for SIP (-system in pack) and BMU (- Battery management unit) quality management, focus on assessing supplier production and quality controls, evaluating supplier readiness, and adherence to module quality plan. Supporting general process development and manufacturing operations within the supply chain.

• Drive Design-for-Manufacturability (DFM) activities with vendors and provide technical support in enhancing process capability and solving technical issues.

• Identify equipment, fixture needs and drive implementation efforts to qualify and optimize the manufacturing process.

• Establish quality and process control plans at vendors for early detection of issues and to ensure the highest quality bar and reliability is consistently delivered.

• Partner with Engineering team to define product acceptance criteria, collaborate with suppliers and Engineering team in assessing, proposing and developing testing plan and metrology on project requirements

• Responsible for conducting Design/Process FMEA, Failure analysis, PPAP, and Statistical Process Control.

• Knowledgeable in conducting DOEs, Line qualification, PCN qualification Machine Buy-off, Cycle Time & UPH studies, and Automation development and qualification.

• Develop and institutionalize our vendor and supplier selection process.

• Publish concise reports on module yield performance, specification convergence status.

• Drive Failure analysis, Corrective Action implementation plan, and yield bridge to mass production.

Key Qualifications

• BS degree in Electrical, Mechanical or Mechatronic Engineering is required.

• 5+ years of experience in SMT, SIP, or IC package industry. Solid knowledge on SMT, SIP process and manufacture quality control. Embedded substrate, flex and semi-conductor such as MOSFET, diodes, TVS, ICs working experience is preferred.

• Solid experience with process control on SMT, flex bending, laser welding, plasma clean, underfill and glue dispensing, SIP molding, EMC (epoxy molding compound) material management, SAT, die saw, die mount and bonding, pattern plating and sputtering.

• Familiarity with quality tools such as SPC, FMEA, GR&R, DoE, metrology, GD&T, TA and Correlation studies.

• Familiarity with data analysis using Excel, Minitab, or JMP.

• Solid experience in developing and qualifying testers, jigs, and fixtures.

• Good at identifying risk and developing solid plans to mitigate

• Good English communication, problem-solving, and collaboration skills.

• Ability and willingness to travel up to 50% to vendors at different locations.