Job Openings Engineers - Principal/ Staff/ Associate Staff

About the job Engineers - Principal/ Staff/ Associate Staff

(5 positions - Module Development/Transfer Project)

Dept: Module PI Operation

  • Requirement as per below technical competency
  • Enclosed example of JD template for your reference

MAJOR JOB DESCRIPTION

  • Participating in development project with RD Engr and to set-up unit process recipe on available tools / BKM recipe / process flow to meet development success criteria.
  • Participating in continuous improvement activities (Defect improvement, Process stability)
  • Oversee overall yield improvement activities with the module and YE.
  • Work with process engineers on process running condition ( DOE ) versus tool capability.
  • Able to communicate well between Module and YE / RD / QA / Etc
  • Able to work with YE / RD / CP to develop COT+ / CUSP process flow

MAJOR RESPONSIBILITIES

  1. Process Management
  • To set-up new process recipe, provide recommendation and integration guidelines to RD Engr and module PE for new development project.
  • Coordinate new process or new technology evaluation/discussion between module and YE & R/D Engr.
  • To identify process limitations, assess process manufacturability and process integration margin on existing tool for new development.
  • Able to Pre review and define COT+ / CUSP before start evaluation.
  • Capable to design the DOE to solve the in line / PCM / Sort issue



2. Yield Improvement

  • Utilize Best Know method (BKM) recipe and process flow for the production.
  • Reduce unnecessary process step for the production.
  • Task Force Team (TFT) participation or involve PSM to solve or improve current production issue.
  • Facilitate engineers for problem solving through DOE

POSITION REQUIREMENT

  • Qualification: Bachelor Science/ Degree/ Masters / Dr in any Engineering related field
  • Experience: Experience in semiconductor to enable the job holder to deal with a wide variety of problems (> 3 years)
  • Skills/Competencies: The job holder will be accepted as a technical expert in his own field who is fully competent to handle both routine and non-routine matters.
  • Wafer Fab process recipe set-up experience and hands-on skill set below for each headcount:

POSITION 1: IMPLANT TECHNICAL COMPETENCY

  • Experience with AMAT VIISTAs & Purion Xe Ion Implanters preferable.
  • Good knowledge with CMOS processes and unit process development experience will be added advantage

POSITION 2: DRY ETCH TECHNICAL COMPETENCY

  • Experience in Silicon Oxide, Silicon Nitride, and Si/Poly-Si etch process.
  • Familiar with AMAT Centura Super-e, AMAT Centura DPS R1 (Poly), AMAT Centura DPS+ (Poly) platform.
  • Experience in SiGe etch will be a surplus.

POSITION 3: WET BENCH / FURNACE TECHNICAL COMPETENCY

  • Experience in Silicon Nitride, Silicon oxide and Poly wet etch process and wet cleaning process
  • Familiar with various wetbench tool type including dipping (DNS/Kaijo), spray (FSI) and backside film removal tool
  • Experience in Furnace Deposition process, Silicon Nitride, Polysilicon and Oxidation process. Hands on skill like recipe set-up and process tuning is important.

POSITION 4: THIN FILM HDP/PECVD TECHNICAL COMPETENCY

  • Familiar and process hands on experience with Applied Material HDP CVD process / PECVD process on Producer/ Novellus for recipe set-up and fine tuning.
  • Familiar and process hands on experience with Applied Material Endura Sputtering System for PVD for recipe set-up and fine tuning.
  • Involved in continuous improvement project, process recipe optimization and development.

POSITION 5: PHOTOLITHOGRAPHY TECHNICAL COMPETENCY

  • Experience with New module setup and qualification
  • Hands on experience with Nikon stepper/scanner and Tel Track Act-8. Including recipe creation, stepper job creation.
  • Familiar with 0.11um technology node design rule and KrF RET

Seniority Level

Mid-Senior level

Industry

    Semiconductor Manufacturing

    Employment Type

    Full-time

    Job Functions

      Engineering

      Skills

      • Thin Films
      • Wet Etching
      • CMOS
      • Stepper
      • Photolithography
      • Sputtering
      • Plasma-Enhanced Chemical Vapor Deposition (PECVD)
      • Dry Etching
      • Chemical Vapor Deposition (CVD)
      • Polysilicon



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