Senior Chip Packaging Engineer

We are working with a design company, and as part of their continued growth, NodeFlair has been engaged to search for Senior Chip Packaging Engineer to join their Singapore team.

The package is competitive at SGD 84k - 126k / year (excluding bonus).

Responsibilities:

• Design packaging solutions, defining SI (signal integration), PI (power integration), and thermal performance criteria.
• Optimize power performance, focusing on PI and SI.
• Coordinate technical communication with packaging and testing vendors.

Requirements:

• Good at EDA tools cadence is a plus
• Bachelors or higher in Electronic Engineering, Microelectronics, Computer Science, or related field.
• 5+ years in packaging design or project development.
• Strong communication, coordination, and teamwork skills.
• English and Chinese proficiency is a plus.

Interested applicants, please contact Ayla at ayla@nodeflair.com for a confidential discussion.

EA License No: 19S9830