External Contractor - Advanced Package Design Engineer

Job Title:

External Contractor - Advanced Package Design Engineer

Requirements / Experiences:

1. Bachelors/Masters degree in Electronics, Electrical, Microelectronics or other related Engineering field.
2. At least 5 years of related working experience in semiconductor industry.
3. Laminate physical layout experience equipped with signal/power integrity knowledge and simulation capability
4. Hands on experience using Design and/or Simulation Tools (Cadence, ANSYS, Mentor, AutoCAD, ADS, Spice, or any relevant).
5. Good knowledge of Signal Integrity fundamentals including Electromagnetics, transmission line theory and S-parameters will be considered a major asset.
6. Strong communication and interpersonal skills.
7. Ability to work productively independently and in a team environment

Job Descriptions:

1. Responsible for WLCSP/ WLBGA, eWLB package, Wirebond package & Flipchip package feasibility study, design & design review with OSAT & substrate suppliers.
2. Perform laminate substrate physical layout and electrical analysis for success design tape out.
3. Perform design rules and DFMEA update.
4. Support drafting activities for substrate unit drawing, strip drawing, bond master & bonding diagram creation, update and submission in system.
5. Participate in 2nd source supplier qualification activities (this is updated requirement for this position